What is Cu clip package? copper roof strip

Power chips are connected to exterior circuits through packaging, and their performance depends on the assistance of the packaging. In high-power circumstances, power chips are usually packaged as power components. Chip affiliation refers to the electric link on the top surface of the chip, which is generally aluminum bonding cord in typical modules. ^
Typical power module package cross-section

Currently, industrial silicon carbide power modules still mainly utilize the product packaging modern technology of this wire-bonded typical silicon IGBT component. They face problems such as huge high-frequency parasitic criteria, inadequate warmth dissipation ability, low-temperature resistance, and inadequate insulation toughness, which restrict the use of silicon carbide semiconductors. The screen of exceptional efficiency. In order to solve these troubles and completely make use of the huge prospective advantages of silicon carbide chips, lots of brand-new packaging technologies and services for silicon carbide power modules have actually emerged over the last few years.

Silicon carbide power module bonding method


(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding materials have established from gold cord bonding in 2001 to light weight aluminum wire (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have actually created from gold wires to copper wires, and the driving pressure is cost reduction; high-power devices have created from light weight aluminum wires (strips) to Cu Clips, and the driving pressure is to boost product efficiency. The greater the power, the greater the requirements.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that utilizes a solid copper bridge soldered to solder to connect chips and pins. Compared to conventional bonding product packaging techniques, Cu Clip technology has the adhering to advantages:

1. The connection between the chip and the pins is constructed from copper sheets, which, to a certain level, replaces the conventional cable bonding method in between the chip and the pins. Consequently, a distinct package resistance worth, higher current flow, and much better thermal conductivity can be gotten.

2. The lead pin welding location does not require to be silver-plated, which can totally save the cost of silver plating and bad silver plating.

3. The item look is totally regular with regular products and is primarily made use of in web servers, portable computers, batteries/drives, graphics cards, electric motors, power materials, and other areas.

Cu Clip has two bonding approaches.

All copper sheet bonding method

Both eviction pad and the Source pad are clip-based. This bonding approach is more costly and complicated, however it can achieve far better Rdson and far better thermal results.


( copper strip)

Copper sheet plus cord bonding approach

The resource pad makes use of a Clip approach, and the Gate utilizes a Cable method. This bonding approach is a little less expensive than the all-copper bonding approach, conserving wafer area (appropriate to very little gate locations). The process is simpler than the all-copper bonding method and can obtain much better Rdson and far better thermal effect.

Provider of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper roof strip, please feel free to contact us and send an inquiry.

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